发明名称 Backlight module having housing provided with groove structure
摘要 The present invention relates to a backlight module having housing provided with groove structure, wherein the backlight module comprises: a housing, a plurality of LED chips, a thermal conductive layer, a reflector, and a light guide plate. In which, the housing has a groove formed on a housing bottom thereof, and the circuit layer is disposed in the groove through a first thermally conductive insulating layer. In addition, the plurality of LED chips are disposed in the housing and welded on the circuit layer. In the present invention, the circuit layer and the LED chips are disposed in the groove of the housing, therefore, when mass producing the backlight module, it is able to ensure that the position of LED chips would correspond to the circuit layer in the housing, such that each the backlight module manufactured by mass production can be used for providing a stable light source.
申请公布号 US8449165(B2) 申请公布日期 2013.05.28
申请号 US201113223571 申请日期 2011.09.01
申请人 CHEN TSAN-JUNG;KOCAM INTERNATIONAL CO. LTD. 发明人 CHEN TSAN-JUNG
分类号 F21V7/00 主分类号 F21V7/00
代理机构 代理人
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