POLYAMIDE RESIN COMPOSITION WITH EXCELLENT IMPACT RESISTANCE

摘要

PURPOSE: A polyamide resin composition is provided to elaborately mold the composition due to low shrinking ability, to perform a convenient molding by excellent workability, and to have transparent aesthetic appearance and excellent antibacterial property. CONSTITUTION: A polyamide resin composition comprises: amorphous polyamide formed by condensation polymerization of octadecanoic acid and bis(3-methyl-4-aminocyclohexyl)methane; and 1-40 weight% of buffer based on the total weight of the composition. The buffer is selected from the group consisting of ethylene-butyl acrylate, ethylene propylene copolymer grafted with 5 weight% of glycidyl methacrylate copolymer and 0.5 weight% of maleic anhydride, ethylene octene copolymer grafted with 0.95 weigh% of maleic anhydride, and their mixture.