METHOD FOR ENCAPSULANT DISPENCING IN LIGHT EMITTING DIODE MAKING

摘要

PURPOSE: A method for filling encapsulant for a light emitting diode is provided to save costs by reducing the use amount of high refractivity silicon. CONSTITUTION: A first encapsulant is filled in order to cover a light emitting chip(S110). A second encapsulant is filled in the outside space of the region filled with the first encapsulant on a cavity(S120). The first encapsulant includes phosphor and high refractivity silicon. The refractivity of the high refractivity silicon is 1.4 to 1.6. A second encapsulant includes low refractivity silicon and SOG(Spin On Glass). [Reference numerals] (S110) Fill a first encapsulant; (S120) Fill a second encapsulant