| 摘要 |
PURPOSE: A light emitting device package and a method for manufacturing the same are provided to simplify a process by successively growing a reflection layer and a heat radiation layer from a seed layer. CONSTITUTION: A seed layer(310) is exposed by selectively patterning a photoresist layer(320). A reflection layer(330) is formed on the seed layer. A heat radiation layer(350) is formed on the reflection layer. The photoresist layer is removed. A light emitting device is separated from a supporter(300).
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