Chemical mechanical polishing slurry compositions for polishing metal wirings,申请号KR20080130089-传众专利搜索

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发明名称	Chemical mechanical polishing slurry compositions for polishing metal wirings
摘要	<p>본 발명의 CMP 슬러리 조성물은 금속 배선 및 질화 규소(silicon nitride)에 대한 연마 속도가 우수하므로 금속 배선 연마 공정에 유용하다.</p>
申请公布号	KR101266537(B1)	申请公布日期	2013.05.27
申请号	KR20080130089	申请日期	2008.12.19
申请人		发明人
分类号	C09K3/14	主分类号	C09K3/14
代理机构		代理人
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