发明名称 A THERMALLY CONTROLLED ASSEMBLY
摘要 A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.
申请公布号 KR20130054280(A) 申请公布日期 2013.05.24
申请号 KR20127030519 申请日期 2011.04.19
申请人 NAPATECH A 发明人 EK CLAUS;STOREMOEN CHRISTOFFER
分类号 H05K7/20;H05K1/14 主分类号 H05K7/20
代理机构 代理人
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