SUBSTRATE BONDING METHOD

摘要

PURPOSE: A substrate bonding method is provided to arrange an edge of a bonding surface of an anisotropic conductive film in an upper direction of a protruded part, thereby evenly bonding a flexible circuit board in a central part of the anisotropic conductive film. CONSTITUTION: Bonding objects(100) are sequentially stacked in a stage(11) having a protruded part(11a). The protruded part is formed to have a curvature embossed to a top part. The bonding object has a substrate(20), an anisotropic conductive film(30) and a flexible circuit board(40). The bonding objects are pressurized through a bonding member(10). The bonding objects are reciprocally bonded.