SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
摘要
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent a warpage phenomenon by performing a reflow process after an unhardened resin is formed in a substrate. CONSTITUTION: A substrate(110) has two surfaces. A semiconductor device(120) is mounted on one surface of the substrate. An external connection terminal(111) is formed on the other surface of the substrate. A warpage protection layer(130) is formed on one or the other surface of the substrate. The warpage protection layer is made of a hardened shrinkage material.</p>
