| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolution, and adhesion, and to provide a photosensitive element, a resist pattern forming method, and a print circuit board manufacturing method using the photosensitive resin composition. <P>SOLUTION: A photosensitive resin composition contains (A) binder polymer, (B) photopolymerizable compound, and (C) photopolymerization initiator. The (C) photopolymerization initiator contains a compound represented by a specific formula (1). <P>COPYRIGHT: (C)2013,JPO&INPIT |
