| 发明名称 |
PHOTOCURABLE RESIN COMPOSITION AND CURED MATERIAL THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance due to tarnish by oxidation of a copper circuit. <P>SOLUTION: The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; (C) a compound having two or more ethylenically unsaturated groups in a molecule; and (D) a red colorant, excluding anthraquinone one. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013101395(A) |
申请公布日期 |
2013.05.23 |
| 申请号 |
JP20130025814 |
申请日期 |
2013.02.13 |
| 申请人 |
TAIYO HOLDINGS CO LTD;TAIYO INK (SUZHOU) CO LTD |
发明人 |
IWAYAMA HARUTO;KIMURA NORIO;ARIMA MASAO |
| 分类号 |
G03F7/004;G03F7/027;H05K3/28 |
主分类号 |
G03F7/004 |
| 代理机构 |
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代理人 |
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