发明名称 METHOD FOR FORMING MIMCAP STRUCTURE, AND MIMCAP STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a MIMCAP structure which comprises a high dielectric constant dielectric and does not cause further oxidization that forms detrimental interfacial layers. <P>SOLUTION: An electronic device includes a first electrode, and a layer of a dielectric material including titanium oxide and a first dopant ion. The layer of the dielectric material is formed on the first electrode. The first dopant ion has a size mismatch of 10% or lower compared to the Ti<SP POS="POST">4+</SP>ion, and the dielectric material has a rutile tetragonal crystalline structure at temperatures below 650&deg;C. The electronic device further includes a second electrode, formed upon the dielectric material layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013102157(A) 申请公布日期 2013.05.23
申请号 JP20120231021 申请日期 2012.10.18
申请人 IMEC 发明人 MIHAELA IOANA POPOVICI
分类号 H01L21/8242;C23C16/40;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
主权项
地址