COPPER PARTICLE DISPERSION, CONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT SUBSTRATE

摘要

Provided is a formulation for a copper particle dispersion comprising dispersed copper particles. This copper particle dispersion has copper particles, at least one dispersion medium which contains the copper particles, and at least one dispersant for dispersing the copper particles in the dispersion medium. The copper particles have a median particle diameter of greater than or equal to 1nm and less than 100nm. The dispersion medium is a polar dispersion medium. The dispersant is a compound having at least one acidic functional group and a molecular weight of 200-100000, or a salt thereof. By this configuration, the dispersant is compatible with the dispersion medium, and, because the surface of the copper particles is covered by dispersant molecules, the copper particles are dispersed in the dispersion medium.