发明名称 COMBINED RESONATORS AND PASSIVE CIRCUIT COMPONENTS ON A SHARED SUBSTRATE
摘要 <p>This disclosure provides implementations of electromechanical systems combined resonator and passive circuit component structures, devices, apparatus, systems, and related processes. In one aspect, the device includes a piezoelectric resonator structure formed over an insulating substrate. A portion of the piezoelectric resonator structure is spaced apart from the substrate by a first gap. A passive circuit component structure such as an inductor or a capacitor is formed over the insulating substrate. A portion of the passive circuit component structure is spaced apart from the substrate by a second gap. The first gap and the second gap are defined by removal of a sacrificial (SAC) layer.</p>
申请公布号 WO2013074261(A1) 申请公布日期 2013.05.23
申请号 WO2012US61678 申请日期 2012.10.24
申请人 QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 ZUO, CHENGJIE;LO, CHI SHUN;JOO, SANGHOON;YUN, CHANGHAN;KIM, JONGHAE
分类号 H03H3/02;H03H9/02 主分类号 H03H3/02
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