发明名称 |
COMBINED RESONATORS AND PASSIVE CIRCUIT COMPONENTS ON A SHARED SUBSTRATE |
摘要 |
<p>This disclosure provides implementations of electromechanical systems combined resonator and passive circuit component structures, devices, apparatus, systems, and related processes. In one aspect, the device includes a piezoelectric resonator structure formed over an insulating substrate. A portion of the piezoelectric resonator structure is spaced apart from the substrate by a first gap. A passive circuit component structure such as an inductor or a capacitor is formed over the insulating substrate. A portion of the passive circuit component structure is spaced apart from the substrate by a second gap. The first gap and the second gap are defined by removal of a sacrificial (SAC) layer.</p> |
申请公布号 |
WO2013074261(A1) |
申请公布日期 |
2013.05.23 |
申请号 |
WO2012US61678 |
申请日期 |
2012.10.24 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
ZUO, CHENGJIE;LO, CHI SHUN;JOO, SANGHOON;YUN, CHANGHAN;KIM, JONGHAE |
分类号 |
H03H3/02;H03H9/02 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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