| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, which suppresses generation of a missing contact hole in a process using a developing solution containing an organic solvent, and which is excellent in lithographic characteristics. <P>SOLUTION: The radiation-sensitive resin composition is used for a method for forming a negative resist pattern using a developing solution containing 80 mass% or more of an organic solvent; and the resin composition comprises [A] a base polymer having an acid dissociable group, [B] a polymer having a higher fluorine atom content percentage than that of the [A] polymer, [C] a radiation-sensitive acid generator, [D] a solvent, and [E] a compound having a relative permittivity higher at least by 15 than the relative permittivity of the [D] solvent. The [A] polymer has a structural unit expressed by formula (1) described below. The [E] compound is included in an amount of 10 pts.mass or more and 200 pts.mass or less with respect to 100 pts.mass of the [A] polymer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
