| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding device equipped with a piezo stage of linear reciprocation rapid response, and an intermetallic junction structure using the same, capable of generating a precision intermetallic junction part which is stable. <P>SOLUTION: An intermetallic junction structure 1 which joins an electronic component such as a semiconductor device or LED, a lithium ion battery, and an electrode terminal of a PV solar battery to a junction mating electrode terminal at a normal temperature has a pair of piezoelectric elements 6c and 6c for linear reciprocation movement on the right and left sides of a linear reciprocation moving body 6a. Using a piezo stage 6 of linear reciprocation rapid response that performs linear reciprocation movement, in order that an electrode terminal 2a is moved in linear reciprocation along with an amplitude generated by the piezo stage of linear reciprocation rapid response, an electrode terminal is fixed to the piezo stage of the linear reciprocation rapid response, for an intermetallic junction part 1a to be generated between the junction of the electrode terminal and a junction mating electrode terminal 3a. At least any one of an electronic component 2 and a junction mating device 3 is fixed to a substrate 9 through a silicone rubber 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
