发明名称 |
Integrated Circuit Including Interconnect Levels |
摘要 |
An integrated circuit as described herein includes an upper interconnect level including a continuous upper interconnect area, the continuous upper interconnect area including a plurality of upper contact openings. The integrated circuit further includes a lower interconnect level including a continuous lower interconnect area, the continuous lower interconnect area including a plurality of lower contact openings. First contacts extend through the lower contact openings to the upper interconnect area and second contact openings extend through the upper contact openings to the lower interconnect area.
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申请公布号 |
US2013127066(A1) |
申请公布日期 |
2013.05.23 |
申请号 |
US201313739389 |
申请日期 |
2013.01.11 |
申请人 |
INFINEON TECHNOLOGIES AG;INFINEON TECHNOLOGIES AG |
发明人 |
GIETLER HERBERT;ZOJER GERHARD;FINKE BENJAMIN |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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