| 摘要 |
PURPOSE: A heat-dissipating plate of an LED(Light-Emitting Diode) lamp device is provided to improve thermal conduction efficiency by forming a thermal conduction coating layer on the bottom surface of a PCB(Printed Circuit Board) heat-dissipating plate. CONSTITUTION: A lamp device lower body forms heat-dissipating fins. A PCB heat-dissipating plate is fixed on the lamp device lower body. A ventilation hole group part(9) prepares multiple ventilation holes on the PCB heat-dissipating plate. An LED lamp(11) is attached to an LED lamp circuit board(12). A thermal conduction coating layer is formed on the bottom surface of the PCB heat-dissipating plate. |
