| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board stable and excellent in conduction between a wiring layer formed on at least one of a surface and a rear face of a ceramic layer, and a via conductor or a through hole conductor, which penetrates the ceramic layer; and provide a manufacturing method of reliably manufacturing the wiring board in a simple process. <P>SOLUTION: A wiring board 1e comprises: a ceramic layer S having a surface Sa and a rear face Sb; wiring layers P1, P4 formed on the surface Sa and the rear face Sb of the ceramic layer, respectively; and via conductors V each penetrating the ceramic layer S and each having ends v connected to the wiring layers P1, P4. The ends v of the via conductor V protrude outward (upward and downward) from surfaces of the wiring layers P1, P4, respectively, and have annular connection surfaces F(f1) when viewed from above, between the surfaces of the via conductor V and the wiring layers P1, P4, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
