| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide welding equipment that can suppress deformation of an object to be welded. <P>SOLUTION: In the welding equipment 100, a semiconductor element 50 and a connector 60 are welded each other in a parallel gap manner. The welding equipment includes: a welding stage 10 that includes a horizontal placing surface 12 and on which the semiconductor element 50 and the connector 60 are sequentially overlaid to be placed on the placing surface 12; a pair of welding electrodes 30 for welding the semiconductor element 50 and the connector 60 each other by conducting a welding current between the semiconductor element 50 and the connector 60; and a pressing surface 42 parallel to the placing surface 12. When the semiconductor element 50 and the connector 60 are welded each other, the pressing surface 42 presses the connector 60. <P>COPYRIGHT: (C)2013,JPO&INPIT |
