发明名称 INTEGRAL BONDING ATTACHMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a robust ground reference in an airplane. <P>SOLUTION: An integral bonding attachment (34) includes an insulated section (65) of a conductive wire (43) with an exposed, uninsulated section (66). A sleeve (44) covers the insulated and uninsulated sections of the conductive wire, and includes a flattened section (50) encasing at least a portion of the uninsulated wire section to form a generally integral structure with a core (63) of the conductive wire. At least one generally tubular section (46), (48) is positioned at an end of the flattened section (50) to engage the insulated section (65) of the conductive wire (43). An aperture (54) may pass simultaneously through the core (63) and flattened sleeve section (50) for attaching the integral bonding attachment to a structure. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013102685(A) 申请公布日期 2013.05.23
申请号 JP20130007526 申请日期 2013.01.18
申请人 TENSOLITE LLC 发明人 DAVID CHARLES CECIL;JACK EDGAR SUTHERLAND
分类号 H02G15/00;H01R4/64;H01R4/70 主分类号 H02G15/00
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