发明名称 |
METHOD AND APPARATUS PROVIDING ELECTRICAL CONNECTION TO A PHOTOVOLTAIC MODULE |
摘要 |
Disclosed embodiments include photovoltaic modules having a conductor interface and a heat-activated adhesive layer configured to bond the conductor interface to the module. Methods of manufacturing photovoltaic modules having a conductor interface and heat-activated adhesive layer are also disclosed. |
申请公布号 |
WO2013074305(A2) |
申请公布日期 |
2013.05.23 |
申请号 |
WO2012US63335 |
申请日期 |
2012.11.02 |
申请人 |
FIRST SOLAR, INC.;MALIK, RICHARD S., JR. |
发明人 |
MALIK, RICHARD S., JR. |
分类号 |
H01L31/02;H01L31/18 |
主分类号 |
H01L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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