| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent disconnection of a metal ribbon while maintaining a bonding strength even when a thickness of the metal ribbon is decreased in connection with downsizing of a semiconductor chip in manufacturing of a semiconductor device including a step of bonding the metal ribbon with a pad of the semiconductor chip. <P>SOLUTION: When bonding is performed by pressure-welding of a thermocompressive bonding surface of a wedge tool 10 while applying supersonic oscillation to an Al ribbon aligned on a surface of a pad of a semiconductor chip, both ends in a width direction of the Al ribbon bonded to the pad are prevented from contacting the thermocompressive bonding surface of the wedge tool 10 by providing recesses 10a on both ends of the thermocompressive bonding surface of the wedge tool 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
