发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting device that can be made compact as a whole by shortening the downward stroke of a component when a mounting head mounts a component on a circuit board, while enhancing the mounting precision. <P>SOLUTION: An inversion head 20 for inverting a component 4 sucked by means of a nozzle 20a vertically includes a planar proximal part 31 provided on a vertically movable base 21d, a nozzle holder support member 33 having an arcuate outer peripheral surface 41a supported by a plurality of bearings 32 provided on the proximal part 31 and capable of oscillating in a horizontal plane, and a nozzle holder 34 supported rotatably about a horizontal axis CX by the nozzle holder support member 33 and holding the nozzle 20a on the side face. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013102016(A) 申请公布日期 2013.05.23
申请号 JP20110244231 申请日期 2011.11.08
申请人 PANASONIC CORP 发明人 KADOTA SHOZO;YAMADA AKIRA
分类号 H05K13/04;H01L21/60 主分类号 H05K13/04
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