| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method which can achieve high reliability by inhibiting occurrence of voids. <P>SOLUTION: A semiconductor device manufacturing method comprises: an alignment process of aligning a semiconductor chip on which bump electrodes having solder tips on a substrate via a bonding material; a contact process of performing heating at a low temperature lower than a solder melting point to contact the bump electrodes and electrode parts of the substrate without completely curing the bonding material; a void removing process of heating the semi-cured bonding material under a pressure atmosphere to remove voids; and an electrode bonding process of performing heating at a temperature equal to or higher than the solder melting point to bond the bump electrodes of the semiconductor chip and the electrode parts of the substrate by melting. <P>COPYRIGHT: (C)2013,JPO&INPIT |
