| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component package capable of preventing a fused solder from flowing into the package along the inner wall of a metal cover when sealing the metal cover on a base by solder-joint, and avoiding occurrence of internal sounds generated in the package by a solder ball. <P>SOLUTION: An electronic component package consists of: a base 2 approximately square in plan view; a plurality of lead pin terminals 5 stood erected and fixed to the base 2; a printed circuit board 3 held floated in the lead pin terminals 5; a piezoelectric transducer 4 provided on the principal plane of the printed circuit board 3; and a metal cover 6 fitted in the base 2. A frame part 2a projected like a flange is provided at the peripheral edge of an outer peripheral part of the base 2, and both of the metal cover 6 and the frame part 2a are sealed by soldering S after fitting an inner peripheral wall 6a of the metal cover 6 to an outer peripheral side surface 2c of the frame part 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
