| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of fusing substrate layers by which the substrate layers are pasted while preventing the deformation of an area formed in the substrate layer. <P>SOLUTION: The method of fusing the substrate layers includes a dissolving process S1 of treating a joining surface of the substrate comprising a resin with an organic solvent having solubility to the resin and a press-bonding process S2 of press-bonding the treated substrate layer by heating to a temperature below a glass transition temperature or a softening point temperature of the resin. Because the substrate layers are press-bonded by heating at the temperature below the glass transition temperature of the softening point temperature of the resin by treating the joining surface of the substrate layer with the organic solvent before press-bonding the substrate layer in the fusing method, the deformation of the area formed in the substrate layer is prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT |
