Substrate Conveyance Method and Substrate Conveyance System

摘要

[Object] To provide a wafer conveyance method and a wafer conveyance system that are able to quickly transfer a wafer without losing positional accuracy. [Solving Means] Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface (210) of a conveyance robot, the wafer (W) is transferred from a supporting surface (303) to the holding surface (210) in the state where an electrostatic attraction force is generated at the holding surface (210). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (210), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.