CURABLE COMPOSITION, COMPOSITION FOR APPLICATION, CURED FILM, LASER PROCESSING METHOD, AND MANUFACTURING METHOD FOR MULTI-LAYER WIRING STRUCTURE

摘要

The purpose of the present invention is to provide a curable composition from which a cured film with low permittivity, low water absorbance, and laser processability can be obtained, a laser processing method for the cured layer, and a manufacturing method for a multi-layer wiring structure. Provided are a curable composition containing a fluorine-containing polyarylene prepolymer (A) with a cross-linked functional group; a laser processing method wherein part of the cured film is removed by radiating laser light onto the cured film obtained by curing this composition; and a manufacturing method for a multi-layer wiring structure comprising a step for forming a via hole in an insulating film comprising the cured film by means of said processing method.