发明名称 |
NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD |
摘要 |
There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility. A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin. |
申请公布号 |
US2013131215(A1) |
申请公布日期 |
2013.05.23 |
申请号 |
US201113811749 |
申请日期 |
2011.07.19 |
申请人 |
SATOU YUTAKA;DIC CORPORATION |
发明人 |
SATOU YUTAKA |
分类号 |
C08G8/10;C08G8/02 |
主分类号 |
C08G8/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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