| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid chemical for forming a water-repellent protecting film which resolves a pattern collapse of a wafer having an uneven pattern with metal elements formed on surfaces thereof. <P>SOLUTION: After a cleaning step and before a drying step for a wafer 1, at least surfaces including recessed portions 4 are replaced with a liquid chemical for forming a water-repellent protecting film represented by the general formula [1]. (R<SP POS="POST">1</SP>represents a C1-C18 monovalent hydrocarbon group the hydrogen elements of which may be partially or entirely substituted by a fluorine element(s), R<SP POS="POST">2</SP>mutually independently represents a monovalent organic group having a C1-C18 hydrocarbon group the hydrogen elements of which may be partially or entirely substituted by a fluorine element(s), and a is an integer from 0 to 2.) <P>COPYRIGHT: (C)2013,JPO&INPIT |
