发明名称 POLISHING METHOD AND POLISHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To efficiently perform the cooling of a polishing pad and slurry and the dressing of a surface of the polishing pad. <P>SOLUTION: According to one embodiment, a polishing method includes steps of: pressing a substrate rotated against a rotating polishing pad 13 and supplying slurry on the polishing pad 13; measuring a surface temperature of the polishing pad 13; and when the surface temperature is not lower than a predetermined temperature, jetting a jet stream containing supercooled droplets from a nozzle 15 having a narrow portion toward the polishing pad 13. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013099814(A) 申请公布日期 2013.05.23
申请号 JP20110244581 申请日期 2011.11.08
申请人 TOSHIBA CORP 发明人 KODERA MASAKO;MATSUI YUKITERU
分类号 B24B37/015;H01L21/304 主分类号 B24B37/015
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