| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronics copper alloy having low Youngs modulus, high proof strength, high electrical conductivity, excellent stress relaxation resistance and excellent bendability, and suitable for electronics components such as a terminal, connector and relay; and to provide a method for production thereof, an electronics copper alloy plastic-forming material, and an electronics component. <P>SOLUTION: The electronics copper alloy contains 3.3-6.9 atom% Mg, 0.001-0.15 atom% at least one of Cr and Zr, and the balance of substantially Cu with inevitable impurities. An electrical conductivity σ (%IACS) is made to be σ≤1.7241/(-0.0347×X<SP POS="POST">2</SP>+0.6569×X+1.7)×100 when the concentration of Mg is refined as X atom%, and a stress relaxation rate at 150°C for 1,000 hr is ≤50%. Further, in the observation by a scanning electron microscope, the average number of intermetallic compounds including Cu and Mg having a grain size of ≥0.1 μm as the main components is made to be ≤1 piece/μm<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
