PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method for the same, in which cost is reduced by simplifying a process for a via hole.

SOLUTION: A manufacturing method of the present invention includes: a step of preparing a base substrate 110; a step of forming a pattern layer for forming a via hole by printing of ink for forming the via hole on the base substrate 110; a step of forming an insulation layer 130 on the base substrate 110 including the pattern layer for forming the via hole; and a step of removing the pattern layer for forming the via hole.

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