| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor composition having a low linear expansion coefficient and a low moisture absorption expansion coefficient, and causing no exfoliation after curing, and excellent in PI etchability. <P>SOLUTION: The polyimide precursor composition contains (A) component and at least one of (B) and (C) components wherein the proportion of the (B) and (C) component is 30 to 100 pts.wt. to 100 pts.wt. of the (A) component. (A): a polyimide precursor having (a1) a structural unit of a polyamide acid from 3,3'-4,4'-biphenyltetracarboxylic dianhydride and p-phenylenediamine, and (a2) a structural unit of a polyamide acid from 3,3'-4,4'-biphenyltetracarboxylic dianhydride and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl in a molar ratio of (a1)/(a2)=20/80 to 70/30. (B): an acrylate compound having a cyclohexanedicarbxyimide structure. (C): a polyethylene glycolic compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
