发明名称 |
Forming Low Stress Joints Using Thermal Compress Bonding |
摘要 |
A method of forming a bump structure includes providing a first work piece including a dielectric layer having a top surface; placing a second work piece facing the first work piece; placing a heating tool contacting the second work piece; and heating the second work piece using the heating tool to perform a reflow process. A first solder bump between the first and the second work pieces is melted to form a second solder bump. Before the second solder bump solidifies, pulling the second work piece away from the first work piece, until an angle formed between a tangent line of the second solder bump and the top surface of the dielectric layer is greater than about 50 degrees, wherein the tangent line is drawn at a point where the second solder bump joins the dielectric layer.
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申请公布号 |
US2013128486(A1) |
申请公布日期 |
2013.05.23 |
申请号 |
US201213729978 |
申请日期 |
2012.12.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG KUEI-WEI;LIN WEI-HUNG;WANG LIN-WEI;JANG BOR-PING;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
B23K31/02;H05K1/14;H05K1/18 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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