HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.