Crushing semiconductor molding, comprises producing semiconductor molding having cavity, filling cavity with liquid having density anomaly effect, and cooling liquid below freezing point for producing pressure in cavity

摘要

Crushing semiconductor molding, comprises (a) producing semiconductor molding (5) having a cavity (4), (b) filling the cavity with a liquid having a density anomaly effect, preferably with water, or with liquid surrounding the semiconductor molding, and (c) cooling the liquid below its freezing point for producing pressure in the cavity or on the outer surface of the semiconductor molding such that the semiconductor molding is crushed into fragments by volume expansion of the liquid, which is produced during cooling.