发明名称 STRAINED STRUCTURES OF SEMICONDUCTOR DEVICES
摘要 PURPOSE: A strained structure of a semiconductor device is provided to improve performance by arranging an STI on one surface of a gate stack. CONSTITUTION: A substrate includes a main surface. A gate stack(210) is formed on the main surface of the substrate. An STI(Shallow Trench Isolation)(204) is arranged on one surface of the gate stack. A cavity(222) is filled with a strained structure. The strained structure is distributed between the gate stack and the STI.
申请公布号 KR20130053360(A) 申请公布日期 2013.05.23
申请号 KR20120004986 申请日期 2012.01.16
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 WU CHENG HSIEN;KO CHIH HSIN;WANN CLEMENT HSINGJEN
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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