WAFER BONDING METHOD, AND ELECTRONIC DEVICE MANUFACTURED BY THE SAME

摘要

PURPOSE: A method for bonding a wafer and an electronic device manufactured thereby are provided to improve the bonding force of a semiconductor substrate by improving the planarization of a substrate. CONSTITUTION: A planarization substrate(11) is formed on a motherboard(12). The planarization substrate is separated from the motherboard. Metal bonding layers(13) are formed on the semiconductor substrate and the planarization substrate, respectively. The semiconductor substrate is bonded to the planarization substrate after two metal bonding layers are arranged to face each other.