发明名称 SUBSTRATE INSPECTION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate inspection device whose manufacturing cost is low, and which can simplify respective operations of connection, disconnection between a determination part which determines an electric conduction state of an inspection object substrate and an inspection probe. <P>SOLUTION: An inspection probe 17 connected to a determination part 7a is brought into contact with an electric contact 3a of a printed board 3, and a state of conduction of the printed board 3 is determined by the determination part 7a. A relay substrate 21 includes: a probe side terminal 31 corresponding to a wire cable 19; and a determination part side terminal 33 corresponding to an electric contact 45. The tip part of the electric contact 45 is attachably/detachably brought into contact with the respective determination part side terminals 33 of the relay substrate 21, and the inspection probe 17 is electrically connected with the determination part 7a. The relay substrate 21 is fixed to the top face of a frame-like base plate 11 with a through hole 11a, the probe side terminal 31 is positioned on the internal side of a through hole 11a, and the determination part side terminals 33 are positioned on the outer side of the through hole 11a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013101133(A) 申请公布日期 2013.05.23
申请号 JP20120287624 申请日期 2012.12.28
申请人 YAMAHA FINE TECHNOLOGIES CO LTD 发明人 ISHII TORU;TSUCHIDA KENGO
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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