发明名称 |
WIRE LOOPS, METHODS OF FORMING WIRE LOOPS, AND RELATED PROCESSES |
摘要 |
A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height. |
申请公布号 |
US2013125390(A1) |
申请公布日期 |
2013.05.23 |
申请号 |
US201113812999 |
申请日期 |
2011.08.03 |
申请人 |
GILLOTTI GARY S.;KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
GILLOTTI GARY S. |
分类号 |
H01R43/00 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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