| 摘要 |
A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.
|
