发明名称 METAL FILM MATERIAL PRODUCTION METHOD, AND METAL FILM MATERIAL USING SAME
摘要 <p>Provided is a method of producing metal film materials which have good adhesion with all types of substrates constituting a metal film material, which have excellent etching resistance, and which improve the shape accuracy of obtained patterns; also provided is a metal film material produced using said method. This metal film material production method involves an ink applying step for discharging ink compositions 1) and 2), described below, onto the substrate by the inkjet method, a cured film formation step for forming a cured film by heating and/or exposing to light the applied ink compositions, a catalyst applying step for applying a plating catalyst or precursor thereof to the cured film, and a plating treatment step for plating the applied plating catalyst or precursor thereof. The cured film has a gradient structure in which the composition of the cured product of a first monomer and the cured product of a second monomer changes continuously such that, in the film thickness direction from the side nearest to the substrate to the side furthest from the substrate, the ratio of cured product of the first monomer described below increases and the ratio of cured product of the second monomer described below decreases. Ink composition 1): an ink composition containing at least one type of first monomer having at least one group selected from cyano groups, alkyloxy groups, amino groups, alkylamino groups, pyridyl groups, pyrrolidonyl groups, imidazolyl groups, alkylsulfanyl groups, and cyclic ether groups. Ink composition 2): an ink composition containing at least one type of second monomer having two or more polymerizable groups and different from the first monomer.</p>
申请公布号 WO2013073370(A1) 申请公布日期 2013.05.23
申请号 WO2012JP78195 申请日期 2012.10.31
申请人 FUJIFILM CORPORATION 发明人 KASAI SEISHI
分类号 C23C18/18;H05K3/18 主分类号 C23C18/18
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