发明名称 CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS
摘要 A camera module including a flexible tape substrate (e.g., a flexible printed circuit tape portion) having a plurality of surface mount components and a first frame member mounted to a first side of the substrate and an image sensor and a frame member mounted to an opposing second side of the substrate. The substrate includes a body portion and one or more leads or wing members having conductive contacts thereon extending from the body portion. The wing members may be folded onto the second frame member so that the conductive contacts of the wing members generally face in a different direction than conductive contacts of the body portion to provide an electrical path to the surface mount components in a manner that is free of using vias extending through the substrate. A tubular housing and lens barrel may be mounted to the substrate over the first frame member.
申请公布号 US2013128106(A1) 申请公布日期 2013.05.23
申请号 US201113303312 申请日期 2011.11.23
申请人 TAM SAMUEL;SINGH HARPUNEET;FLEXTRONICS AP, LLC 发明人 TAM SAMUEL;SINGH HARPUNEET
分类号 H04N5/225;H05K13/00 主分类号 H04N5/225
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