PACKAGE HAVING STACKED MEMORY DIES WITH SERIALLY CONNECTED BUFFER DIES

摘要

A multi-chip package has a substrate, and a plurality of memory dies stacked on the substrate. A plurality of buffer dies each has an input and an output. The input of a first buffer die is connectable to an external input. The output of a last buffer die of the plurality of buffer dies is connectable to an external output. Each of the remaining inputs and outputs is connected respectively to an output or an input of another of the plurality of buffer dies to form a serial connection between the plurality of buffer dies. Each of the memory dies is connected to one of the buffer dies, such that each buffer die is connected to its respective memory dies in parallel arrangement. A memory device having multiple serially interconnected MCPs and a controller is also described.