| 摘要 |
A wafer-related data creation device (47) is equipped with: a setting stand on which a wafer pallet (32) is placed; a testing-use suction nozzle (51) that adsorbs dies (31) on a dicing sheet (34) of a wafer pallet placed on the setting stand; testing-use lifter pins (53) that lift the laminated portion of a die that is on the dicing sheet and is in the process of being adsorbed by the suction nozzle; and a testing-use camera (54) that photographs the dies on the dicing sheet. Using this wafer-related data creation device, a wafer pallet for which wafer-related data is to be created is placed on the setting stand of the wafer-related data creation device, the image captured with the testing-use camera is processed, the lifting operation of the testing-use lifter pins and the die-adsorbing operation of the testing-use suction nozzle are executed, and wafer-related data is created. |
