| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device with high reliability. <P>SOLUTION: A semiconductor package 1 includes: a wiring board 2 including a substrate 21, a first conductor pattern 221 provided on one surface side of the substrate 21, and a second conductor pattern 224 provided on the other surface side of the substrate 21 and electrically connected to the first conductor pattern 221; a semiconductor element 3 bonded to the one surface of the substrate 21 and electrically connected to the first conductor pattern 221; reinforcement members 4 and 5 bonded to the wiring board 2 and having a smaller thermal expansion coefficient than the wiring board 2; an insulating resin layer 61 provided so as to cover at least a part of a surface of the reinforcement member 4; and an insulating resin layer 62 provided so as to cover at least a part of a surface of the reinforcement member 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
