发明名称 THERMALLY DRIVEN WORKLOAD SCHEDULING IN A HETEROGENEOUS MULTI-PROCESSOR SYSTEM ON A CHIP
摘要 Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip ("SoC") are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ("QoS") by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
申请公布号 US2013132972(A1) 申请公布日期 2013.05.23
申请号 US201213357777 申请日期 2012.01.25
申请人 SUR SUMIT;ARTMEIER JAMES M.;GUZZI MARK D.;MUELLER, JR. PHILIP T.;RYCHLIK BOHUSLAV;QUALCOMM INCORPORATED 发明人 SUR SUMIT;ARTMEIER JAMES M.;GUZZI MARK D.;MUELLER, JR. PHILIP T.;RYCHLIK BOHUSLAV
分类号 G06F9/46 主分类号 G06F9/46
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