| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor mounting member having high reliability and a method for manufacturing the same. <P>SOLUTION: In the semiconductor mounting member, a second substrate 300 includes an upwardly projecting second connection conductor 332P, and a first substrate 500 includes an upwardly projecting first connection conductor 872P. For instance, a stress generated when the semiconductor mounting member is mounted on an external substrate is released to the first substrate side through the first connection conductor 872P and to the second substrate side through the second connection conductor 332P, and thereby the stress applied to a brittle semiconductor element 90 having high toughness can be relaxed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
