| 摘要 |
Embodiments of the present invention generally relate to sealing and supporting an encapsulated photovoltaic module using a supporting frame. In one embodiment, a supporting frame is grounded and configured to support a peripheral portion of an encapsulated photovoltaic module. The peripheral portion of the encapsulated photovoltaic module may be covered and in physical contact with an electrically conductive foam tape, which is configured to protect the encapsulated photovoltaic module from being abraded by the supporting frame while providing a conductive path between a metal vapor barrier layer laminated in the encapsulated photovoltaic module and the supporting frame. The placement of the electrically conductive foam tape between the supporting frame and the encapsulated photovoltaic module insures a constant discharging of the electrostatic charges accumulated on the metal vapor barrier without any arcing.
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